HaroldA hetero-structure laser diode model |
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Harold VCSEL Laser ModuleIntroductionHAROLD/VCSEL is a full 3D model, computing the mutliple optical cavity modes, electrical drift-diffusion, heat-flow and electron-photon interactions. Building on Photon Design’s 30 year experience in both EM and laser diode modelling, this provides a comprehensive integrated design environment for a variety of the VCSEL variations being explored by industry today, including QW materials, current blocking apertures and more.
Modelling ScopeHAROLD/VCSEL covers the three main areas of modelling:
Optical:
Electrical:
Thermal:
VCSEL EditorStarting from your epitaxy recipe our updated user interface in Harold/VCSEL will make it easy to design your VCSEL, with features for easy definition of DBRs and positioning of contacts and oxide layers.
VCSEL device editor: a base layer structure is modified via the use of
etch and grow processes to allow careful placement of current-blocking
oxide apertures (displayed in the red box) and ring-contacts.
Simulation ResultsHarold/VCSEL is capable of generating a wide variety of simulation results, giving a detailed insight in device behaviour. These include: - Temperature, heat sources - Current and carrier density - Optical mode/far-field Detailed Cross-Sectional and Plan Profiles
Profile of optical mode (left) and temperature (right) inside the cavity
Far-field intensity profile of VCSEL output
Current density profile showing cross-section and plan views of current
flow through oxide layer aperture Steady State Device Results- LIV Curves - Temperature and dissipated heat source powers - Recombination currents - QW gain, carrier density, FCA/IVBA
VCSEL LI curves at different ambient temperatures Time-Domain Results Spectra- Time evolution of optical power and carrier density - Laser output optical spectra (power spectral density), RIN spectra - Lasing linewidth
Time-evolving radial carrier density profile for laser switch-on
Laser output optical spectrum Coming Soon!As the development of Harold/VCSEL continues, we look forward to adding further features and functionality in subsequent releases, including: - Side current injection - Support for wafer bonding - Tunnel junctions - Time-domain dynamics/modulation response spectra - And more... Please contact us if you are interested in these or have any further feature requests.
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